NanoXplore
FPGAs RADIATION HARDENED

NG-MEDIUM RH

NG-MEDIUM is the first Radiation Hardened by Design (RHBD) SRAM-based FPGA developed by NanoXplore. The programmable matrix is built on an interconnect architecture made of 4-input Look-up tables, DFF, 48K-bits RAM, Carry and 19x24 multipliers in a Digital Signal Processing units offering a high logic density.

See the documentation ↗
NG-MEDIUM RH evaluation board
SAFETY

Embedded protection by design, for mission-critical confidence

RELIABILITY

Proven resilience for the harshest environments, from orbit to the edge

PERFORMANCE

Scalable performance and flexibility to meet the most demanding applications

TECHNICAL SPECIFICATIONS

Detailled specifications to ensure optimal performance in every environment

DeviceNX1H35S
Capacity550 000 ASIC Gates
Register32 256
LUT-434 272
Carry8 064
Embedded RAM2,856Mb
DPRAM2,688K
Core Register File168K with ECC
Clocks24
DSP Blocks112
SpaceWire link PHY16
DDR2 PHY16
I/O banks13
LG625 User I/Os374
CQ352 User I/Os192
Satellite in orbit above Earth
Radiation Hardened

Engineered for harsh environments.

  • Radiation hardening by design in configuration memories and registers.
  • SEL immune up to LET > 60MeV.cm2/mg.
  • Device Configuration SER < 1.70 10-4 /day (GEO).
  • Total ionizing dose > 100Krads.
  • Embedded EDAC for user memory mitigation.
  • Embedded bitstream integrity check (CMIC).
Main Features

Built for complex, critical systems.

  • 65 nm STm C65-SPACE process technology.
  • 4-Input Look-up tables.
  • High performance carry chains.
  • Advanced interconnect network to support random logic and coarse grain block functions.
  • DSP Blocks for complex arithmetic operations.
  • User memories with variable width and depth.
  • 5 configuration modes: JTAG, Parallel 8 bits, Parallel 16 bits, Space Wire.
  • Integrated Space Wire interface available for user applications.
  • Dedicated lowskew distribution network for clock, reset and load enable signals.
  • On-chip thermal monitoring capability.
European semiconductor chip
Circuit board chip
Input / Output Features

Connectivity that adapts to your design.

  • Multiple I/O powering support from 1.8V to 3.3V.
  • Cold sparing support.
  • Programmable output drive to support multiple industry standards.
  • Embedded logic to support DDR2 and DDR3.
  • 800 Mbps I/O support.
  • LVDS compatible mode.
  • All pins support 2000V of ESD-HBM.
  • Embedded logic to support Space Wire Data Strobe encoding.
  • Programmable delay lines on all pins.
  • Programmable resistive termination.
DOCUMENTATION

Guiding your project from concept to long term success.

For a complete library of user guides, reference manuals and technical documentation, or if you have any questions about our products, head to our Wiki Page.

See the documentation ↗