NanoXplore
RADIATION HARDENED SOC FPGAS

NG-ULTRA

NG-ULTRA share the same patented FPGA architecture co-developed with ST, combining programmable logic with embedded quad-core ARM® Cortex®-A9 processors, memories, and high-speed interfaces. Optimized for industrial and automotive applications, NG-ULTRA delivers high performance, flexibility, and scalability for cost-sensitive markets.

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NG-ULTRA evaluation board
SECURITY

Embedded protection by design, for mission-critical confidence

RELIABILITY

Proven resilience for the harsheet environments, from orbit to the edge

PERFORMANCE

Scalable performance and flexibility to meet all your system’s needs

TECHNICAL SPECIFICATIONS

Detailled specifications to ensure optimal performance in every environment

DeviceNX2H300TSA
Capacity
- ASIC Gates8 000 000
Logic Modules
- Register505 344
- LUT-4536 928
- Carry126 336
Embedded RAM33Mb
- DPRAM32.256K
- Core Register File2688
- Core Register File Bits1 512K Hardened
Clocks50/7
Additional Features
- SpaceWire link PHY (8 IOBs)20
- DDR2 PHY (11 IOBs)20
- DSP Blocks1344
- SpaceWire link I/F 430Mbps1
- SERDES Tx/Rx 6,5Gbps32
- Hard IP Processor core4
- SoC PeripheralsYES
Design SecurityYES
Inputs / Outputs
- Complex I/O bank10x 34 I/Os
- Simple I/O bank4x 24 I/Os
- Packages - User I/Os740 I/Os
-BGA1760 45*45mm / 1mm436 + SoC 304
Main Features
  • 28 nm STMFDSOI process technology.
  • A full System-On-Chip (SoC) based on a quad-core ARM Cortex R52.
  • 4-Input Look-up tables.
  • LUT expender to support up to 16 bits boolean functions.
  • High performance carry chains.
  • Advanced interconnect network to support random logic and coarse grain block functions.
  • DSP Blocks for complex arithmetic operations.
  • User memories with variable width and depth.
  • Configuration modes: Master Serial SPI (Single, Sequential, TMR), SpaceWire.
  • Development configuration modes: JTAG, Parallel 16 bits, UART.
  • Integrated Space Wire interface available for user applications.
  • Dedicated lowskew distribution network for clock, reset and load enable signals.
  • On-chip thermal monitoring capability.
  • On-chip thermal sensor.
European semiconductor chip
High-speed circuit board
Input / Output Features
  • Multiple I/O powering support from 1.2V to 3.3V.
  • Cold sparing support.
  • Programmable output drive to support multiple industry standards.
  • Embedded logic to support DDR2, DDR3.
  • Up to 1.6 Gbps maximum I/O support for SSTL, HSTL and POD standards.
  • LVDS compatible mode.
  • All pins support 2000V of ESD-HBM.
  • Embedded logic to support Space Wire Data Strobe encoding.
  • Programmable delay lines on complex I/O pins.
  • Programmable resistive termination on complex I/O pins.
Radiation Hardened
  • Radiation hardening by design in configuration memories and registers.
  • SEU immune up to LET > 60MeV.cm2/mg.
  • Total ionizing dose > 50Krads (Si).
  • Embedded EDAC for user memory mitigation.
  • Embedded configuration memory scrubbing.
  • Fast automatic memory configuration repair.
Earth seen from orbit
DOCUMENTATION

Guiding your project from concept to long term success.

For a complete library of user guides, reference manuals and technical documentation, or if you have any questions about our products, head to our Wiki Page.

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PRODUCT BRIEF

Download the complete overview.

Everything you need to know about NG-ULTRA, from architecture to key technical specifications.

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