Embedded protection by design, for mission-critical confidence
FPGAS RADIATION HARDENED
ULTRA300
ULTRA300 is the commercial version of NanoXplore’s second-generation FPGA family. It shares the same programmable architecture as the radiation-hardened ULTRA300 devices, including 4-input Look-up Tables with LUT extenders, configurable DFF, Coarse Grain Blocks, embedded memories, and dedicated DSP units. Optimized for industrial and automotive applications, ULTRA300 combines high logic density, scalability, and performance for cost-sensitive markets.
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Proven resilience for the harshest environments, from orbit to the edge
Scalable performance and flexibility to meet all your system’s needs
Detailled specifications to ensure optimal performance in every environment
DeviceNX2H300TSA
Capacity
- ASIC Gates4 000 000
Logic Modules
- Register273 408
- LUT-4290 496
- Carry68 352
Embedded RAM22Mb
- DPRAM21504
- Core Register File1424
Clocks / PLL50/7
Additional Features
- SpaceWire PHY (8 IOBs)20
- DDR3/4 PHY (11 IOBs)20
- Embeded DSP896
- DSP Blocks1
- SpaceWire link I/F 400Mbps16
- SERDES Tx/Rx 12,5Gbps
- Hard IP Processor core / SoCNO
- ADC / DAC4 / 4
Design SecurityYES
Inputs / Outputs
- Complex I/O bank10x 34 I/Os
- Simple I/O bank1x 16 I/Os + 6x 24 I/Os
Packages - User I/Os500 I/Os
- BGA484 27*27mm / 1mm — HSSL 12,5 Gbps SERDES TX/RX — User IOs4 — 239
- BGA1152 35*35mm / 1mm — HSSL 12,5 Gbps SERDES TX/RX — User IOs16 — 500
Main Features
- 28 nm STMFDSOI process technology.
- 12-bit ADC, 13-bit DAC.
- 4-Input Look-up tables.
- LUT expender to support up to 16 bits boolean functions.
- High performance carry chains.
- Advanced interconnect network to support random logic and coarse grain block functions.
- DSP Blocks for complex arithmetic operations.
- User memories with variable width and depth.
- Configuration modes: JTAG, Parallel 16 bits, Master Serial SPI, SpaceWire, Flash and UART.
- Integrated Space Wire interface available for user applications.
- Dedicated lowskew distribution network for clock, reset and load enable signals.
- On-chip thermal sensor.
Input / Output Features
- Multi voltage I/O support from 1.2V to 3.3V.
- Cold sparing support.
- Programmable output drive to support multiple industry standards.
- Embedded logic to support DDR2, DDR3 and DDR4.
- Up to 1.6 Gbps maximum I/O support for SSTL, HSTL and POD standards.
- LVDS compatible mode.
- All pins support 2000V of ESD-HBM.
- Embedded logic to support Space Wire Data Strobe encoding.
- Programmable delay lines on complex I/O pins.
- Programmable resistive termination on complex I/O pins.
Radiation Hardened
- Radiation hardening by design in configuration memories and registers.
- SEU immune up to LET > 60MeV.cm2/mg.
- Total ionizing dose > 50Krads (Si).
- Embedded EDAC for user memory mitigation.
- Embedded configuration memory scrubbing.
- Fast automatic memory configuration repair.
- Embedded bitstream integrity check (CMIC).
Guiding your project from concept to long term success.
For a complete library of user guides, reference manuals and technical documentation, or if you have any questions about our products, head to our Wiki Page.
See the documentation ↗