NanoXplore
FPGAS RADIATION HARDENED

ULTRA300 RH

ULTRA300 is the second generation of NanoXplore Radiation Hardened by design (RHBD) FPGA. The hardening technics used in the ULTRA300 family alongside the FD-SOI technology offers very strong hardening performance.

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ULTRA300 RH evaluation board
SECURITY

Embedded protection by design, for mission-critical confidence

RELIABILITY

Proven resilience for the harshest environments, from orbit to the edge

PERFORMANCE

Scalable performance and flexibility to meet all your system’s needs

TECHNICAL SPECIFICATIONS

Detailled specifications to ensure optimal performance in every environment

DeviceNX2H300TSA BGA 484NX2H300TSA BGA 1152
Logic Modules
- Register (#)273 408273 408
- LUT-4 (#)290 496290 496
- Carry (#)68 35268 352
Embedded RAM (Mb)2222
- DPRAM (Kb)2150421504
- Core Register File (Kb)14241424
Clocks / PLL50/750/7
Additional Features
- DDR2/3 PHY2020
- Embeded DSP896896
- SpaceWire PHY I/F 400 Mbps2020
- SERDES Tx/Rx 12,5Gbps44
- ADC / DAC4 / 44 / 4
Security featureYESYES
Inputs / Outputs
- High-Speed I/O (HSIO) bank 1,2 V - 1,5 V - 1,8 V4x34 I/Os10x 34 I/Os
- General Purpose I/O (GPIO) bank 1,8 V - 2,5 V - 3,3 V1x 16 I/Os + 4x 24 I/Os1x 16 I/Os + 6x 24 I/Os
- Service I/O bank 3,3 V4857
Packages - User I/Os239 I/Os500 I/Os
Earth seen from orbit
Radiation Hardened
  • Radiation hardening by design in configuration memories and registers.
  • SEU immune up to LET > 60MeV.cm2/mg.
  • Total ionizing dose > 50Krads (Si).
  • Embedded EDAC for user memory mitigation.
  • Embedded configuration memory scrubbing.
  • Fast automatic memory configuration repair.
Main Features
  • 28 nm STMFDSOI process technology.
  • A full System-On-Chip (SoC) based on a quad-core ARM Cortex R52.
  • 4-Input Look-up tables.
  • LUT expander to support up to 16 bits boolean functions.
  • High performance carry chains.
  • Advanced interconnect network to support random logic and coarse grain block functions.
  • DSP Blocks for complex arithmetic operations.
  • User memories with variable width and depth.
  • Configuration modes: Master Serial SPI (Single, Sequential, TMR), SpaceWire.
  • Development configuration modes: JTAG, Parallel 16 bits, UART.
  • Integrated Space Wire interface available for user applications.
  • Dedicated lowskew distribution network for clock, reset and load enable signals.
  • On-chip thermal sensor and monitoring capability.
European semiconductor chip
Circuit board
Input / Output Features
  • Multiple I/O powering support from 1.2V to 3.3V.
  • Cold sparing support.
  • Programmable output drive to support multiple industry standards.
  • Embedded logic to support DDR2, DDR3.
  • Up to 1.6 Gbps maximum I/O support for SSTL, HSTL and POD standards.
  • LVDS compatible mode.
  • All pins support 2000V of ESD-HBM.
  • Embedded logic to support Space Wire Data Strobe encoding.
  • Programmable delay lines on complex I/O pins.
  • Programmable resistive termination on complex I/O pins.
DOCUMENTATION

Guiding your project from concept to long term success.

For a complete library of user guides, reference manuals and technical documentation, or if you have any questions about our products, head to our Wiki Page.

See the documentation ↗
PRODUCT BRIEF

Download the complete overview.

Detailled overview of the ULTRA300 including architecture, radiation performance and key technical specifications.

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